Endicott Interconnect Technologies (EI) Buys 4 More Schmoll Machines
Garden Grove, CA - November 12, 2007

Endicott Interconnect Technologies' Wire Bond Product Launched into Space
Endicott, NY - October 30, 2007

Endicott Interconnect's SiP Designs Reduce PWB Size, Weight, Complexity and Cost
Endicott, NY - October 23, 2007

IPC Honors 15 Member Companies with IPC Founders Awards Proving There Is Life After 40
BANNOCKBURN, Ill., October 1, 2007

PCB Assemblies for High Volume Commercial Applications from Endicott Interconnect Technologies
Endicott, NY - September 27, 2007

2007 College Scholarships Awarded by Endicott Interconnect Technologies, Inc.
ENDICOTT, NY— September 11, 2007

Endicott Interconnect Technologies, Inc. Wins Raytheon Multi-Year Production Contract
ENDICOTT, NY — August 23, 2007

Department of Defense Awards Endicott Interconnect Technologies $19M Contract Modification
ENDICOTT, N.Y.— August 21, 2007

Endicott Interconnect Technologies, Inc. Offers PCB Assembly Capability for High Volume Commercial Applications in Shenzhen, China
ENDICOTT, NY— July 12, 2007

Baker Announces Equipment Sales to Endicott Interconnect Technologies
Thursday, June 7, 2007 M.E. Baker Company

Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract
Endicott, NY— May 29, 2007

Orbotech Receives Major Multi-Million Dollar Order for LDI and AOI Systems from Endicott Interconnect Technologies- Manufacturer Now Largest User of LDI Technology in the Americas -
Billerica, MA – May 24, 2007

HPC-Z Interconnect Solution Provides Vertical PCB Connections with Laminations Instead of Plated Thru-Holes for Increased Circuit Density
Endicott, NY -  May 21, 2007

Thin Core Flip Chip Package Provides 199 Micron Via-to-Via Core Pitch
Endicott, NY - April 2007

Endicott Interconnect Technologies, Inc. Appoints Director of Engineering
ENDICOTT, NY— April 4, 2007

Endicott Interconnect Technologies, Inc. Awarded Multiple Department of Defense Contracts Totaling $164M
ENDICOTT, NY - March 23, 2007

Endicott Interconnect Technologies, Inc. Appoints Vice President of Research & Development
ENDICOTT, NY - March 13, 2007

Technology Neighbors Announce Process Development and Manufacturing Partnership for Medical Application Using World’s Finest Pitch Soldered Flip Chip Interconnect
ENDICOTT, NY - February 22, 2007

Endicott Interconnect Technologies Seeking Professionals and Manufacturing Personnel at Job Fair
ENDICOTT, NY - January 31, 2007

Endicott Interconnect Technologies, Inc. Boosts Sales Infrastructure
ENDICOTT, NY - January 3, 2007