The Power of Products and Technologies

From PCB and semiconductor packaging design and fabrication for advanced applications and complex assembly to custom equipment build, our commitment to the aerospace and defense sector and its prime contractors is as strong and reliable as our product line.

We guarantee your success with our streamlined project management approach and tested technologies which mitigate risk while offering the benefits of reduced size, weight and power (SWaP).

Solutions for defense/aerospace applications are a strategic part of our vision at EI, and we provide customized solutions for a host of projects including:

Avionics & Controls
Space & Airborne Applications
Electronic Warfare
Intelligence Systems
Sensor Systems
Network Centric System

A Domestic Supplier

EI is a dependable supply source for defense/aerospace electronics. Our US manufacturing facility provides a highly secure solution that can address your intellectual property concerns, while delivering rapid turnaround on high complexity, low volume applications.

A systematic approach to quality management ensures a closed loop process from development through product end of life. Customer expectations and product attributes are combined with robust business processes and disciplined manufacturing utilizing process controls and monitors to deliver best in class reliability and defect rates.

EI products meet ISO, IPC and military specifications, RoHS compliance, ITAR registration and are compatible with lead free assembly processes.

Mission:
A prime contractor supplying the US Navy required PCB assembly services in support of the E-2D Advanced Hawkeye Aircraft mission computer.

Solution:
EI won the competitive bid based on our focused customer service, exceptional quality and superior manufacturing capabilities. Our early engineering involvement, technical know-how and support lead to the award of the PCB design and fabrication as well.

Mission:
A key subcontractor supporting the Department of Defense needed high performance semiconductor packaging for an advanced computing application in a highly secure program.

Solution:
EI’s HyperBGA^® was the high performance package selected. Our ability to provide a vertically integrated solution then led to our win of the module assemblies, PCBs, functionally tested PCB assemblies and engineering services to support this program.

Mission:
An OEM supporting NASA required electronic packaging that minimized weight and size without sacrificing reliability and performance for a satellite application.

Solution:
EI’s wire bond PBGA package provided the reliability and performance in a light weight, thin profile package. It has passed flight readiness and is approved for launch.