Nano-Bio Manufacturing Consortium Awards Funding to Binghamton University for Development of Electronics and Biometric Sensor Platforms

Project selected for its focus on optimizing packaging to ensure robustness of wearable sensors
SAN JOSE, Calif., July 30, 2014 /PRNewswire/ – The Nano-Bio Manufacturing Consortium (NBMC), an industry-academia partnership with the United States Air Force Research Laboratory (AFRL), has awarded funding for a project proposed by Binghamton University to develop electronics and biometric sensor platforms for human performance monitoring (HPM). The $425,000 project, with contributions from the University of California, Berkeley, and electronics packaging firm i3 Electronics, Inc. (Endicott, N.Y.), is scheduled for completion in early 2015.

The electronics platform includes a flexible substrate, battery, processor, WiFi communications and interface electronics. The biometric sensor platform includes temperature and electrocardiogram (ECG) sensors, allowing calculation of the wearer’s heart rate. ECG signals from human subjects and from an archive of human ECG recordings (from both healthy individuals and those with clinical conditions) will be utilized to test the sensor electrodes and onboard electronics. The processed data will be used to calculate heart rate, and data transmitted to a local network will be compared to the input signals. These tests will then be repeated on 10 units produced in the manufacturing run, all of which will be used to transmit ECGs, heart rate and temperature from human subjects. A second LED-based oximeter sensor will also be evaluated for the detection of blood oxygen levels and heart rate.

Before establishing final manufacturing protocols and executing the manufacturing run, the team will fabricate and performance-test the integrated platforms to determine whether the HPM solution will be fabricated from electronics and sensor platforms on separate substrates laminated together, or printed and assembled sequentially on the same substrate. Variables evaluated in making this determination will include the quality of “printed” gold electrodes and electrical conductors, substrate bond quality, platform power consumption and peak current demand.

“Package form factor and quality play a vital role in creating robust, wearable HPM solutions that are viable for high-volume manufacturing,” said Raj Rai, i3 Electronics’ chief technology officer. “We are excited to leverage our expertise in board fabrication, packaging, assembly and test for projects such as this that have the potential to enable fundamental improvements in people’s everyday lives.”

Dr. Benjamin J. Leever, AFRL Program Manager for Flexible Materials & Devices, stated, “Wearable HPM sensors have the potential to provide invaluable insight into the state of individual airmen in both operational and medical scenarios. Developing and demonstrating an integrated biometric sensor platform is an essential milestone toward realizing this important goal.”

Binghamton University has primary responsibility for project coordination, systems integration, circuit design and testing, and HPM performance testing. UC Berkeley is responsible for printing and verifying the sensor platforms, while i3 Electronics handles fabricating on flexible substrates, component assembly, manufacturing protocols and the 10-unit manufacturing run for final performance testing. Binghamton’s Dr. James N. Turner, research scientist in the Small Scale Systems Integration & Packaging Center, is the project lead, with UC Berkeley represented by Ana Claudia Arias, associate professor, Dept. of Electrical Engineering and Computer Sciences. The AFRL program manager is Laura S. Rea.

Dr. Turner noted, “As a New York State Center of Excellence, Binghamton University is proud to have this project selected for the NBMC’s efforts to optimize HPM systems for the US Air Force. Partnering with i3 Electronics and UC Berkeley has allowed us a unique opportunity both to collaborate with colleagues at a prestigious institution on the opposite coast, as well as to ‘keep it local’ by working with an Endicott firm known for excellence in electronics packaging. The project also leverages Binghamton University’s Center for Advanced Microelectronics Manufacturing which is a component of the Center of Excellence and a leader in the research for manufacturing of flexible electronics.”

Malcolm Thompson, NBMC’s CEO, said, “The Binghamton University project represents an interesting and well-defined approach to determining the best components and packaging techniques for creating a manufacturable electronic and biometric sensor platform. It will be exciting to see what the results indicate at the conclusion of this project.”

About NBMC
The Nano-Bio Manufacturing Consortium (NBMC) was formed by the FlexTech Alliance, for the U.S. Air Force Research Laboratory (AFRL). NBMC brings together leading scientists, engineers, and business development professionals from industry and universities to mature an integrated suite of nano-bio manufacturing technologies and transition to industrial manufacturing. To do so, NBMC operates at the confluence of emerging disciplines: nanotechnology, biotechnology, advanced (additive) manufacturing, and flexible electronics – enabling advanced sensor architectures for real-time, remote physiological and health monitoring.

i3 Electronics Fabrication Highlight: July 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This substrate was manufactured for the Medical electronics industry.

The Product

  • Double sided flexible substrate
  • Kapton Polyimide
  • Piece size: 1.5″ x 2.1″
  • 11 µm lines and spaces
  • 25 µm vias
  • Fully assembled

JulyPCB

Why i3?

The customer came to i3 for this build because of our ability to fabricate and assemble advanced flexible electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins Military Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Defense firm has awarded the Company an order for the supply of assembled modules for an analog to digital power conversion application. i3 will manufacture the substrates in addition to providing assembly services.

“i3 is equipped to manufacture advanced substrate technology as well as provide complete turnkey assembly services. Our vertically integrated business model enables us to provide our end customers with a complete manufactured solution”, stated Robert Nead, President at i3 Electronics.

 About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins Printed Circuit Board Fabrication Opportunity For Mobile Payments Industry

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has partnered with a leader in the “mobile payments” industry. For this project, i3 has developed a novel printed circuit board manufacturing process, which will greatly enable the customer’s ability to provide innovative mobile payment solutions.

“i3 is always looking to penetrate new markets, especially ones that show great growth potential. The proliferation of mobile payment technology has increased greatly over the past several years and we are pleased to be supplying our technology for these applications, stated Robert Nead, President at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Offering Printed Circuit Board Subcontracting Services

i3 Electronics, Inc. (i3) has decades of experience fabricating and assembling printed circuit boards (PCB) and semiconductor packages. i3 will now be offering PCB subcontracting services to the marketplace.

Our subcontracting services include:

  • Solderable Surface/ Wirebondable Finish Offerings
  • Universal Metal Surface Finish
  • Immersion Ag For Solderable Surface
  • High Temp/ Multiple Reflow Resistant OSP
  • Alternative Oxide Processing
  • Copper Plating
  • PTH Drilling/ Via Formation
  • Autoclave
  • Buried Resistor Trimming
  • And much more

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics Fabrication Highlight: June 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This substrate was manufactured for the RF & Microwave industry

The Product

  • HyperBGA
  • PTFE with mixed KPPE/Rogers materials
  • 20,000 pieces per panel
  • Panel size: 13.5″ x 18″; 30 mils thick
  • Piece size: .043″ x .043″
  • Blind and buried vias

JuneHighlight

Why i3?

The customer came to i3 for this build because of our ability to fabricate PTFE products for their RF & microwave applications.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins Printed Circuit Board Fabrication Program

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Defense firm has awarded the Company a contract for the supply of i3’s high-complexity, high-reliability printed circuit boards (PCBs) for a military application, using advanced resistor material.

“i3 has been supplying the A&D industry with some of the most complex and reliable printed circuit boards for over ten years. Our dedication to manufacturing a quality product, right here in the USA, has enabled our war fighters and our country, stated Robert Nead, President at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics’ Current Induced Thermal Cycling (CITC) Test Method Now Validated By IPC

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that its Current Induced Thermal Cycling (CITC) test is now an official IPC validated test method with the release of Revision A to IPC-TM-650 Method 2.6.26. i3’s CITC testing, used for Printed Circuit Board (PCB) reliability testing, can be found as Method B in this most recent revision.

i3 will now be making its CITC testers and testing services available for purchase to the market place.

i3’s CITC tester holds many distinct advantages over the industry standard PCB test methods including: smallest possible single net coupon; quick coupon connect/disconnect; controlled heat cycle ramp and dwell for fastest and most accurate cycle at any temperature; “Ultimate CITC” option for starting temps as low as -55C; temperature coefficient of resistance always measured; and typical test results for lot acceptance or reliability verification in less than 2 hours.

“i3 has been using CITC technology to test the reliability of our printed circuit boards for over 20 years. Now that this test method has been validated by IPC we can move forward with our strategy of officially offering this test to the industry”, stated Robert Nead, President at i3 Electronics.

citcimage

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics Fabrication Highlight: May 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This substrate and assembled packaged was manufactured for the Aerospace market

The Product

  • HyperBGA
  • 31 mm  X 31 mm
  • 9 Layers
  • Specialized Teflon product
  • 3,000 blind vias and plates holes
  • Fully assembled

MayPCB

Why i3?

The customer came to i3 for this build because of our ability to fabricate and assemble complex and mission-critical semiconductor substrates and assembled packages.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins Printed Circuit Board Fabrication Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Telecommunications firm has awarded the Company a substantial contract for the supply of i3’s high-complexity, high-reliability printed circuit boards (PCBs) for a satellite application.

“i3’s printed circuit board fabrication capabilities are industry-leading. We are dedicated to providing our customers with the most complex and reliable PCBs on the market.” said Robert Nead President at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.