ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has partnered with a leader in the “mobile payments” industry. For this project, i3 has developed a novel printed circuit board manufacturing process, which will greatly enable the customer’s ability to provide innovative mobile payment solutions.
“i3 is always looking to penetrate new markets, especially ones that show great growth potential. The proliferation of mobile payment technology has increased greatly over the past several years and we are pleased to be supplying our technology for these applications, stated Robert Nead, President at i3 Electronics.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.