i3 Electronics To Present At 2016 AAS Guidance and Control Conference

ENDICOTT, NY— i3 Electronics, Inc. (i3) will be presenting a joint paper with the Jet Propulsion Laboratory (JPL) at the 39th Annual American Astronautical Society’s Guidance and Control Conference, which will be held at the Beaver Run Resort in Breckenridge, Colorado February 5-10.

The collaborative efforts of, “Conceive, Believe and Achieve; A Path To Miniaturization, COTS Infusion, And SWaP Realization For Flight”, will be presented by members of both the i3 and JPL teams on February 7th which will highlight advanced packaging technologies for future high performance and high reliability space applications.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit, www.i3electronics.com.

i3 Electronics To Exhibit At DesignCon 2016

ENDICOTT, NY— i3 Electronics, Inc. (i3) will be exhibiting at DesignCon 2016, which will be held at the Santa Clara Convention Center in Santa Clara, California January 19-21.

i3 will showcase their advanced printed circuit board and semiconductor packaging technology for the industrial, commercial, medical and aerospace industries. In addition, i3 will have information available on their world-class advanced laboratory services and their Current Induced Thermal Cycling (CITC) test technology, which holds many distinct advantages over traditional printed circuit board reliability tests.

i3 will be in booth #1155.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit, www.i3electronics.com.

About DesignCon

DesignCon, produced by UBM Canon, is the world’s premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This four-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry’s leading experts and solutions providers. More information is available at: www.designcon.com/santaclara/. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.

i3 Electronics, Inc. Earns “Preferred Supplier” Status From Raytheon

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has recently been added to Raytheon’s “Preferred Supplier List” (PSL).

i3 Electronics has earned this “Preferred Supplier” status by continuously delivering a high level of performance and value-add to Raytheon. Designation of this prestigious “Preferred Supplier listing” will allow i3 to work even more closely with Raytheon and their world-class team of engineers, scientists and problem solvers.

“The designation of “Preferred Supplier’ from Raytheon is a progressive step for our company. i3 has demonstrated time and again that our technical capabilities and value are unmatched in the industry. We are excited to work with Raytheon on future projects that provide real-world solutions”, stated Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics’ Frank Egitto Wins Lifetime Achievement Award

ENDICOTT, NY— Frank D. Egitto, Director of Research and Development at i3 Electronics, Inc. in Endicott, NY was presented with the Technology Innovation Lifetime Achievement Award by the Small Scale Systems Integration and Packaging Center (S³IP), Binghamton University, and the Empire State Development Division of Science, Technology & Innovation (NYSTAR) at the S³IP Annual Dinner & Business Meeting on November 4, 2015.

In introducing the presenter of the award, Steve Czarnecki, Associate Director of S³IP stated, “Our final category is, in some ways, the most significant, and to me, the most prestigious: life is not a sprint, but a marathon.  It is, after all so often the case that it’s sustained performance that matters.  To that end, we have the Technology Innovation Lifetime Achievement award.  This award, given only infrequently, recognizes an individual in the electronics packaging industry who has built a lifetime record of leadership and service to the industry as well as the University.” The award was presented by Dr. Mark Poliks, Director of the Center for Advanced Microelectronics Manufacturing (CAMM), and longtime friend and colleague of Mr. Egitto.

Frank Award

An alumnus of Binghamton University, where he earned BA and MA degrees in Physics, Mr. Egitto has maintained a long standing relationship with the university and its faculty.  “Collaborative work with the S³IP Center has been a productive and mutually beneficial partnership”, stated Mr. Egitto. “Because of the nature of my work, this has been especially true with respect to the Integrated Electronics Engineering Center (IEEC), the Analytical and Diagnostics Laboratory (ADL), and the CAMM, the nation’s first prototype research and development facility in large area flexible electronics.

In his nearly thirty-eight years working in the microelectronics industry, thirty-three of which has been in Endicott, Mr. Egitto’s activities have focused on research and development on materials, equipment, design, and processes for fabrication of integrated circuit chips and advanced microelectronic packaging solutions. Previous work experience includes employment with Texas Instruments, Dallas, TX, Applied Materials Plasma Etch Division, Santa Clara, CA, IBM Microelectronics Division, Endicott, NY, Endicott Interconnect Technologies, Inc., Endicott NY and i3 Electronics Inc., Endicott NY. His areas of expertise include plasma interactions with materials, laser ablation, modification of polymers with ultraviolet radiation, and advanced packaging.  He is the author or coauthor of eight book chapters and over eighty technical papers, and holds eighty-seven US patents.  He has served on the Technical Advisory Board and the Industrial Advisory Board for the IEEC at Binghamton University. He has had a career of leadership in moving projects through research and development into manufacturing of equipment, high-density flexible circuitry, semiconductor packaging, and printed wiring boards.

“My career has afforded me the opportunity to bring fundamental scientific and engineering principles to bear on real world applications, and taking these applications from feasibility demonstration to real products that enhance the lives of others. By far, the most fulfilling aspect of my work has been my collaboration with colleagues in industry and academia, who I consider to be among the best and brightest, truly world-class in their respective areas of expertise. In addition, throughout my career, I’ve been fortunate that management has fostered innovation by supporting the freedom to work on emergent technologies using a fundamental scientific approach to development and problem solving. Of course, the opportunities for innovation are never-ending and expanding, with microelectronics continually moving into new and challenging areas of science and technology,” stated Mr. Egitto.

“Frank Egitto is a true asset to i3 Electronics. His dedication to this company and the impact he has made on the microelectronics industry cannot be overstated. Here at i3 Electronics, we are truly honored and proud to have Frank as part of our organization and look forward to his continued work. I would also like to personally congratulate Frank on this well-deserved award, stated Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

About S³IP & NYSTAR

S³IP brings together the resources of several organized research initiatives including: the Integrated Electronics Engineering Center (IEEC), a New York State Center of Advanced Technology, known for leading edge research in electronics packaging; the National Science Foundation Industry/University Cooperative Research Center in Energy-Smart Electronic Systems (ES2), developing new dynamic, predictive, and synergistic energy optimization and thermal management design criteria enabling U.S. data centers and electronic systems to operate efficiently and securely; the Center for Autonomous Solar Power (CASP), focused on new energy production and storage technologies; the Center for Advanced Microelectronics Manufacturing (CAMM), a national microelectronics R&D center demonstrating the feasibility of roll-to-roll flexible electronics manufacturing; and the Northeast Center for Chemical Energy Storage (NECCES) , an effort being led by Binghamton University to support basic research in the design of the next generation of lithium-ion batteries (LiBs), which requires both the development of new chemistries and the fundamental understanding of the physical and chemical processes that occur in these complex systems.  Underpinning these research initiatives is the Analytical and Diagnostics Laboratory (ADL). NYSTAR’s responsibilities include the administration and oversight of the seven Centers of Excellence (COE) across New York State, including S³IP.  The Centers of Excellence Program supports major upgrades of research facilities and other high technology and biotechnology capital projects, allowing colleges, universities and research institutions to secure research funding that will lead to new job creation. NYSTAR defines the mission of S³IP at Binghamton University as “advancing the frontiers of microelectronics research and development, specifically addressing challenges in small scale systems design, development, prototyping, process development and manufacturing for the microelectronics industry.”

i3 Electronics To Exhibit At SC15

ENDICOTT, NY— i3 Electronics, Inc. (i3) will be exhibiting at SC15, which will be held at the Austin Convention Center in Austin, Texas November 16-19.

“i3 Electronics is a world-class supplier of high performance computing design and manufacturing services. Exhibiting at this show is essential for us as a means of showcasing our technology and expertise”, stated Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.

i3 will be presenting the following:
  • “High Performance Compute Cluster Constructed With High Density Rigid-Flex Based Modules” from 4:00-4:30 PM on 11/17 in 12AB

i3 will be in booth #2802

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit, www.i3electronics.com.

i3 Electronics, Inc. Wins Medical Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has earned the opportunity from a multi-national medical imaging conglomerate for the manufacture and advanced assembly of flexible substrates. This technology will be used to non-invasively measure real-time, three-dimensional organ abnormalities.

“i3 is a true enabler. From design, through fabrication, assembly and test, i3 provides a distinct advantage to our customers and their patients, with our life-saving technologies and world-class reliability,” said Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit, www.i3electronics.com.

i3 Electronics, Inc. Wins Prototype Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has earned the opportunity from an industry leading technology/computing company for the development and manufacture of advanced substrates utilizing embedded component technology. The product will be used in the company’s next generation communications devices.

“i3’s substrate technology is second-to-none in the industry. Our expertise in fabricating substrates with embedded components provides a reduction in size, weight and power (SWaP) which enables us to support our customers in ways our competition cannot,” said Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, high speed laminates, advanced assembly, reliability and signal integrity reliability labs, high speed back plane & press fit assembly, and flexible electronics & assembly. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Holds Global Sales Meeting

ENDICOTT, NY— i3 Electronics, Inc. (i3) held a two day global sales meeting from August 19th through August 20th. The sales meeting brought together employees from key organizational areas including management, supply chain, operations, business development, program management, marketing, finance, human resources and engineering to discuss company strategy on how to further increase i3’s presence in the electronics marketplace.

“Our 2015 global sales meeting was a great success. I have complete confidence in the i3 team as we continue to strengthen and grow our business. Our people and our technology are world-class and I am proud to be a part of such a great organization,” stated Dale Kersten, Executive VP and Chief Business Officer at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging; high speed laminates; advanced assembly; reliability and signal integrity labs; high speed back plane & press fit assembly; and flexible electronics fabrication & assembly. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Earns Critical Recertification

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has recently completed assessment for recertification to several critical Quality Management Standards including AS9100C (Aerospace, Military and Defense Standard) and ISO 13485:2003 (Medical Devices).

“i3 Electronics has a strong Quality Management System, and is committed to the on-time delivery of high quality products, that exceed our customer demands.  These recertifications are a testament to the dedication of all i3 associates to our Quality System”, stated Dale Kersten, Executive VP and Chief Business Officer at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging; advanced assembly; reliability and signal integrity labs; high speed back plane & press fit assembly; and flexible electronics fabrication & assembly. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial, and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins Medical Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has earned the opportunity from an industry leading medical OEM for the development and manufacture of advanced, flexible, circuitized substrates. The product is a flexible, LCP substrate that will be used in the neurostimulation market.

“i3’s advanced flex technology is revolutionizing the medical industry. Our commitment to supplying our customers with the industry’s highest-reliability products enables them to improve the lives of thousands of people every day,” said Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, high speed laminates, advanced assembly, reliability and signal integrity reliability labs, high speed back plane & press fit assembly, and flexible electronics & assembly. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.