May 14, 2013
Endicott Interconnect Technologies, Inc. (EI) has received the United Way of Broome County’s Thomas J. Watson Society Gold Award. The Gold Award is presented in recognition of charitable contributions in the range of $50,000 and $99,999. It is an achievement from the Thomas J. Watson Society, recognizing leadership in charitable giving in support of the [...]
May 2, 2013
Endicott, NY — Endicott Interconnect Technologies, Inc. (EI) announced today that its System-In-Package technology performed successfully as a key subsystem of Lockheed Martin’s Extended Area Protection and Survivability (EAPS) Program during a test on March 22 at White Sands Missile Range, N.M. EI’s technology acts as the command center of a very small hit-to-kill interceptor [...]
April 23, 2013
Endicott Interconnect Technologies, Inc. (EI) announced today that CEO Jay McNamara retired as of Friday April 12, 2013. Mr. McNamara had been the President & CEO of Endicott Interconnect since its inception in 2002 as a divestiture of IBM’s Microelectronics Division. Mr. McNamara has taken EI from a company with only a few customers, in [...]
April 22, 2013
Endicott Interconnect Technologies plans to exhibit at three trade shows in the month of May, including: 2013 IMAPS Workshop on Packaging the Next Generation of Nano Devices in Albany, NY (4/30-5/1) IMAPS New England Chapter’s 40th Annual Symposium and Exposition in Boxborough, MA (5/7) 2013 IMAPS Microelectronic Packaging for Medical & Hi-Rel Devices in Minneapolis, [...]
March 21, 2013
Endicott Interconnect will be exhibiting at the 2013 Bay Area Biomedical Device Conference being held on March 27th, 2013 at the San Jose State University Student Union Building. Endicott Interconnect will be showcasing our cutting edge technologies in the medical device market including microflex and system-in-package. Hope to see you there!
March 5, 2013
Endicott Interconnect Technologies will be exhibiting (booth #6) at this year’s IMAPS Conference and Exhibition on Device Packaging, set to be held from March12-14 in Scottsdale, Arizona. EI’s Dr. Rabindra Das will be presenting three papers at the conference “3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics” on Tuesday March 12th at 2:30 [...]
November 28, 2012
Package on Package (PoP) stacking has become an attractive method for 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging designs need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller [...]
October 24, 2012
We will regularly highlight our capabilities in PCB manufacturing by releasing information on a particular build. Here is our second highlight: 72 Layers Conductive paste 4 subs Megtron 4 397 mils thick Silica holefill 3 mil line widths Impedance controlled ENEPIG surface finish Soldermask
October 2, 2012
Endicott Interconnect Technologies, Inc. (EI) recently announced the promotion of Rajinder Rai to the position of Chief Technology Officer (CTO) reporting to James J. McNamara Jr., President and CEO. In his new position, Raj will be responsible for monitoring new technologies, overseeing the selection of research projects, generating a technology road-map and ensuring its progress [...]
September 17, 2012
Endicott Interconnect’s Dr. Rabindra Das recently presented several papers at IMAPS 45th International Symposium On Microelectronics in San Diego, California. Dr. Das presented his findings on the following topics: Package-Interposer-Package (PIP): A Breakthrough Package-on-Package (PoP) Technology for 3D-Integration Rediscovering Multilayer Rigid-Flex with Z-interconnect Technology Miniaturization of Electronic Substrates for Medical Device Applications EI’s “Miniaturization of [...]