i3 Electronics, Inc. (i3) has decades of experience fabricating and assembling printed circuit boards (PCB) and semiconductor packages. i3 will now be offering PCB subcontracting services to the marketplace.
Our subcontracting services include:
- Solderable Surface/ Wirebondable Finish Offerings
- Universal Metal Surface Finish
- Immersion Ag For Solderable Surface
- High Temp/ Multiple Reflow Resistant OSP
- Alternative Oxide Processing
- Copper Plating
- PTH Drilling/ Via Formation
- Buried Resistor Trimming
- And much more
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.