i3 Electronics, Inc. Wins Printed Circuit Board Fabrication Opportunity For Mobile Payments Industry

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has partnered with a leader in the “mobile payments” industry. For this project, i3 has developed a novel printed circuit board manufacturing process, which will greatly enable the customer’s ability to provide innovative mobile payment solutions.

“i3 is always looking to penetrate new markets, especially ones that show great growth potential. The proliferation of mobile payment technology has increased greatly over the past several years and we are pleased to be supplying our technology for these applications, stated Robert Nead, President at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Offering Printed Circuit Board Subcontracting Services

i3 Electronics, Inc. (i3) has decades of experience fabricating and assembling printed circuit boards (PCB) and semiconductor packages. i3 will now be offering PCB subcontracting services to the marketplace.

Our subcontracting services include:

  • Solderable Surface/ Wirebondable Finish Offerings
  • Universal Metal Surface Finish
  • Immersion Ag For Solderable Surface
  • High Temp/ Multiple Reflow Resistant OSP
  • Alternative Oxide Processing
  • Copper Plating
  • PTH Drilling/ Via Formation
  • Autoclave
  • Buried Resistor Trimming
  • And much more

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics Fabrication Highlight: June 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This substrate was manufactured for the RF & Microwave industry

The Product

  • HyperBGA
  • PTFE with mixed KPPE/Rogers materials
  • 20,000 pieces per panel
  • Panel size: 13.5″ x 18″; 30 mils thick
  • Piece size: .043″ x .043″
  • Blind and buried vias

JuneHighlight

Why i3?

The customer came to i3 for this build because of our ability to fabricate PTFE products for their RF & microwave applications.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins Printed Circuit Board Fabrication Program

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Defense firm has awarded the Company a contract for the supply of i3’s high-complexity, high-reliability printed circuit boards (PCBs) for a military application, using advanced resistor material.

“i3 has been supplying the A&D industry with some of the most complex and reliable printed circuit boards for over ten years. Our dedication to manufacturing a quality product, right here in the USA, has enabled our war fighters and our country, stated Robert Nead, President at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics’ Current Induced Thermal Cycling (CITC) Test Method Now Validated By IPC

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that its Current Induced Thermal Cycling (CITC) test is now an official IPC validated test method with the release of Revision A to IPC-TM-650 Method 2.6.26. i3’s CITC testing, used for Printed Circuit Board (PCB) reliability testing, can be found as Method B in this most recent revision.

i3 will now be making its CITC testers and testing services available for purchase to the market place.

i3’s CITC tester holds many distinct advantages over the industry standard PCB test methods including: smallest possible single net coupon; quick coupon connect/disconnect; controlled heat cycle ramp and dwell for fastest and most accurate cycle at any temperature; “Ultimate CITC” option for starting temps as low as -55C; temperature coefficient of resistance always measured; and typical test results for lot acceptance or reliability verification in less than 2 hours.

“i3 has been using CITC technology to test the reliability of our printed circuit boards for over 20 years. Now that this test method has been validated by IPC we can move forward with our strategy of officially offering this test to the industry”, stated Robert Nead, President at i3 Electronics.

citcimage

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics Fabrication Highlight: May 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This substrate and assembled packaged was manufactured for the Aerospace market

The Product

  • HyperBGA
  • 31 mm  X 31 mm
  • 9 Layers
  • Specialized Teflon product
  • 3,000 blind vias and plates holes
  • Fully assembled

MayPCB

Why i3?

The customer came to i3 for this build because of our ability to fabricate and assemble complex and mission-critical semiconductor substrates and assembled packages.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins Printed Circuit Board Fabrication Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Telecommunications firm has awarded the Company a substantial contract for the supply of i3’s high-complexity, high-reliability printed circuit boards (PCBs) for a satellite application.

“i3’s printed circuit board fabrication capabilities are industry-leading. We are dedicated to providing our customers with the most complex and reliable PCBs on the market.” said Robert Nead President at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

IBM Agrees To Purchase i3 Electronics CITC Testers

ENDICOTT, NY – i3 Electronics, Inc announced today that it has received a commitment from IBM to purchase the company’s Current Induced Thermal Cycling (CITC) Testers for in-house PCB reliability testing. Delivery of the machines is scheduled for the second half of 2014.

“When we became aware that i3 Electronics was making CITC testers available for sale, we were very interested. We were attracted to the CITC tester’s efficiency and cost effectiveness in measuring PCB reliability”, stated Mark Morizio (Director, ISC Engineering) at IBM.

“We are very excited to be offering our own CITC Tester to the market place. We truly believe that our product holds unique benefits over other industry standard test methods. We look forward to working with a variety of customers to provide them with a unique and reliable method for testing the reliability of their printed circuit boards”, stated Robert Nead, President at i3 Electronics.

About i3 Electronics’ CITC Tester

i3’s CITC Tester offers many benefits over the industry standard testing methods such as smallest possible single net coupon, quick coupon connect/disconnect, controlled heat cycle ramp and dwell for the fastest and most accurate cycle at any temperature, “ultimate CITC” option for starting temperatures as low as -55C, measured temperature coefficient of resistance, and reliability verification in less than 2 hours.

i3’s CITC Test is set to be approved as Method B in the upcoming release of IPC-TM-650-2.6.26A.

i3 will be offering CITC Testers as well as CITC testing services to the market place.

For more information please click here and fill out the embedded form.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics Fabrication Highlight: April 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This printed circuit board was manufactured for the high-end server market

The Product

  • Printed circuit board
  • Mixed Megtron materials
  • 255 mils thick
  • 44 layers
  • 23.1 x 18.1 in
  • 30,000 holes
  • Tight registration; 3 mil lines and spaces

LGA_5x_df_Mosaic_1

Why i3?

The customer came to i3 for this build because of our ability to fabricate high layer count, complex PCBs. i3 has a strong reputation for highly reliable and complex printed circuit board fabrication.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics Now Selling Current Induced Thermal Cycling (CITC) Testers and Testing Services

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has made its Current Induced Thermal Cycling (CITC) testers and testing services available for purchase. i3’s CITC testing can be found as Method B in the upcoming release of IPC-TM-650-2.6.26A.

i3’s CITC tester holds many distinct advantages over the industry standard PCB test methods including: smallest possible single net coupon; quick coupon connect/disconnect; controlled heat cycle ramp and dwell for the fastest and most accurate cycle at any temperature; “Ultimate CITC” option for starting temps as low as -55C; temperature coefficient of resistance always measured; and typical test results for lot acceptance or reliability verification in less than 2 hours.

“i3 has been using CITC technology to test the reliability of our printed circuit boards for over 20 years. We are excited to be offering this technology to the marketplace”, stated Robert Nead, President at i3 Electronics.

For additional technical or sales information please click here and fill out the embedded form.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.