i3 Electronics Attracts Dale Kersten as Executive Vice President and Chief Business Officer

Endicott, NY (March 9, 2015) – A significant announcement from i3 Electronics in Endicott, NY today: Dale Kersten has joined i3 Electronics as Executive Vice President and Chief Business Officer. The appointment is effective immediately.

Kersten comes to i3 Electronics from California-based electronics manufacturer Sanmina Corporation, and will be responsible for the development of all business technology solutions and building key customer relationships at i3 Electronics.

Dale Kersten - Executive Vice President and Chief Business Officer

Dale Kersten – Executive Vice President and Chief Business Officer

“The addition of Dale Kersten to our team is another significant step for i3 Electronics’ long-term growth strategy,” said Jim Matthews, Jr., President and CEO. “Dale is recognized globally as a leader in this industry. His expert technical background and ability to build key industry relationships will help us to attract even more business, and expand i3’s impact in this changing marketplace.”

i3 Electronics has been working to leverage its technologies and capabilities to secure Intellectual Properties and advanced products while keeping with customer expectations. As a leader in the industry, the company has secured long-term contracts from many customers, and is pursuing new industries with its advanced technologies and highly skilled workforce.

Prior to joining i3 Electronics, Kersten served as the VP of Global Engineering for Sanmina Corporation’s Interconnect Division. In that role, he developed strategies and managed goals for improvement focusing on value add manufacturing. He was responsible for product performances and controls through the development of new technologies and processes, as well as the development of new customer relationships and accounts.

Regarding his new position, Kersten says that: “There is tremendous opportunity here as many of the technologies employed by i3 Electronics are needed for the advanced products being designed today. i3 is in the perfect position to take advantage of these opportunities and support a high-end customer base.”

Kersten praised i3 Electronics’ intellectual properties and advanced capabilities, and said he plans to build upon the team’s momentum in service, technology, and reliability through persistence, determination and knowledge-sharing with customers.

As part of the company’s long-term growth strategy, i3 Electronics is also focusing on developing an even more efficient advanced design and manufacturing environment to provide highly cost-effective electronic products and solutions for its customers.

i3 Electronics is a vertically integrated manufacturer of high-performance, electronic-packaging solutions, which includes the design and fabrication of printed-circuit boards and advanced semiconductor packaging, turnkey services for printed-circuit board and integrated-circuits assembly and testing, systems integration, and advanced-laboratory services.

Jim Matthews Jr. to serve as President and CEO of i3 Electronics

After more than a year of strategic turnaround, i3 Electronics is proud to announce that we are now beginning to implement a long-term growth strategy.  The company is in the process of adding more high-quality employees, including new leadership positions for this growth.

High-Tech manufacturing continues to be an opportunity in the U.S.  As a leader in this industry, we are proud to have secured long-term contracts from many of our customers, and we are pursuing new industries with our advanced technologies and highly skilled workforce.  i3 Electronics is also focusing on developing a more efficient advanced design and manufacturing environment to provide highly cost-effective electronic products and solutions for its customers.

To help achieve greater efficiencies, the company is planning to make substantial investment to create a more cost-effective footprint for its operations.  This will enable i3 Electronics to consolidate space, invest in new equipment, reduce energy and operational costs, improve R&D capabilities, and improve competitiveness.

As a long-established company in the region and a large employer, we also look forward to supporting the Regional Economic Development Council initiative to secure state funding for expansions, new construction, redevelopment, and new hires.  The company has a long-term commitment to our community, and our goal remains to position i3 Electronics for the future of advanced manufacturing, with as many high-quality paying jobs in the Greater Binghamton area as possible.

Now that the initial stages of the turnaround are complete and the business is stable, Robert L Nead will be stepping down as President of i3 Electronics, and the roles of President and CEO will become one position to provide a single leader for the future of the organization.  Robert has been valued tremendously and contributed significantly during the turnaround of this company, and we are thankful for his leadership.  Jim Matthews will serve as President in addition to his role as CEO.

i3 Electronics, Inc. Wins Military Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Defense firm has awarded the Company an order for the supply of advanced substrates for a military application. The order will run through the remainder of 2014.

“We pride ourselves on manufacturing some of the most advanced substrates on the market. Our commitment to quality and reliability are key enabling factors when manufacturing product for the military”, stated Robert Nead, President at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Signs Multi Year Agreement For Assemblies

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that the company has signed a multi-year agreement with an industry leading High Performance Computing firm for the supply of high performance electronic assemblies. i3 will manufacture the printed circuit boards and provide assembly, integration and test services.

“As a vertically integrated North American manufacturer, i3 is equipped to provide the industry with a complete solution that is on the cutting edge of technology. Our ability to manufacture a complete solution at our Endicott facility allows a quicker time to market for our customers and a distinct competitive advantage”, stated Robert Nead, President at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com

i3 Electronics Fabrication Highlight: August 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This printed circuit board was manufactured and assembled for the Electronic Design Automation (EDA) industry.

The Product

  • Megtron material
  • 24″ x 28″
  • Over 250,000 interconnections
  • 400 mils thick, 72 layers
  • 99.5+% final composite yield
  • Excellent signal integrity and increased wiring density due to lack of back-drill or PTH stubs
  • Fully assembled with advanced surface mount technology

AugustPCB

Why i3?

The customer came to i3 for this build because of our ability to fabricate and assemble very advanced and high tech printed circuit boards and assemblies. Our vertically integrated business model allows us to design, manufacture and assemble complex electronic solutions.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

Nano-Bio Manufacturing Consortium Awards Funding to Binghamton University for Development of Electronics and Biometric Sensor Platforms

Project selected for its focus on optimizing packaging to ensure robustness of wearable sensors
SAN JOSE, Calif., July 30, 2014 /PRNewswire/ – The Nano-Bio Manufacturing Consortium (NBMC), an industry-academia partnership with the United States Air Force Research Laboratory (AFRL), has awarded funding for a project proposed by Binghamton University to develop electronics and biometric sensor platforms for human performance monitoring (HPM). The $425,000 project, with contributions from the University of California, Berkeley, and electronics packaging firm i3 Electronics, Inc. (Endicott, N.Y.), is scheduled for completion in early 2015.

The electronics platform includes a flexible substrate, battery, processor, WiFi communications and interface electronics. The biometric sensor platform includes temperature and electrocardiogram (ECG) sensors, allowing calculation of the wearer’s heart rate. ECG signals from human subjects and from an archive of human ECG recordings (from both healthy individuals and those with clinical conditions) will be utilized to test the sensor electrodes and onboard electronics. The processed data will be used to calculate heart rate, and data transmitted to a local network will be compared to the input signals. These tests will then be repeated on 10 units produced in the manufacturing run, all of which will be used to transmit ECGs, heart rate and temperature from human subjects. A second LED-based oximeter sensor will also be evaluated for the detection of blood oxygen levels and heart rate.

Before establishing final manufacturing protocols and executing the manufacturing run, the team will fabricate and performance-test the integrated platforms to determine whether the HPM solution will be fabricated from electronics and sensor platforms on separate substrates laminated together, or printed and assembled sequentially on the same substrate. Variables evaluated in making this determination will include the quality of “printed” gold electrodes and electrical conductors, substrate bond quality, platform power consumption and peak current demand.

“Package form factor and quality play a vital role in creating robust, wearable HPM solutions that are viable for high-volume manufacturing,” said Raj Rai, i3 Electronics’ chief technology officer. “We are excited to leverage our expertise in board fabrication, packaging, assembly and test for projects such as this that have the potential to enable fundamental improvements in people’s everyday lives.”

Dr. Benjamin J. Leever, AFRL Program Manager for Flexible Materials & Devices, stated, “Wearable HPM sensors have the potential to provide invaluable insight into the state of individual airmen in both operational and medical scenarios. Developing and demonstrating an integrated biometric sensor platform is an essential milestone toward realizing this important goal.”

Binghamton University has primary responsibility for project coordination, systems integration, circuit design and testing, and HPM performance testing. UC Berkeley is responsible for printing and verifying the sensor platforms, while i3 Electronics handles fabricating on flexible substrates, component assembly, manufacturing protocols and the 10-unit manufacturing run for final performance testing. Binghamton’s Dr. James N. Turner, research scientist in the Small Scale Systems Integration & Packaging Center, is the project lead, with UC Berkeley represented by Ana Claudia Arias, associate professor, Dept. of Electrical Engineering and Computer Sciences. The AFRL program manager is Laura S. Rea.

Dr. Turner noted, “As a New York State Center of Excellence, Binghamton University is proud to have this project selected for the NBMC’s efforts to optimize HPM systems for the US Air Force. Partnering with i3 Electronics and UC Berkeley has allowed us a unique opportunity both to collaborate with colleagues at a prestigious institution on the opposite coast, as well as to ‘keep it local’ by working with an Endicott firm known for excellence in electronics packaging. The project also leverages Binghamton University’s Center for Advanced Microelectronics Manufacturing which is a component of the Center of Excellence and a leader in the research for manufacturing of flexible electronics.”

Malcolm Thompson, NBMC’s CEO, said, “The Binghamton University project represents an interesting and well-defined approach to determining the best components and packaging techniques for creating a manufacturable electronic and biometric sensor platform. It will be exciting to see what the results indicate at the conclusion of this project.”

About NBMC
The Nano-Bio Manufacturing Consortium (NBMC) was formed by the FlexTech Alliance, for the U.S. Air Force Research Laboratory (AFRL). NBMC brings together leading scientists, engineers, and business development professionals from industry and universities to mature an integrated suite of nano-bio manufacturing technologies and transition to industrial manufacturing. To do so, NBMC operates at the confluence of emerging disciplines: nanotechnology, biotechnology, advanced (additive) manufacturing, and flexible electronics – enabling advanced sensor architectures for real-time, remote physiological and health monitoring.

i3 Electronics Fabrication Highlight: July 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This substrate was manufactured for the Medical electronics industry.

The Product

  • Double sided flexible substrate
  • Kapton Polyimide
  • Piece size: 1.5″ x 2.1″
  • 11 µm lines and spaces
  • 25 µm vias
  • Fully assembled

JulyPCB

Why i3?

The customer came to i3 for this build because of our ability to fabricate and assemble advanced flexible electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins Military Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Aerospace and Defense firm has awarded the Company an order for the supply of assembled modules for an analog to digital power conversion application. i3 will manufacture the substrates in addition to providing assembly services.

“i3 is equipped to manufacture advanced substrate technology as well as provide complete turnkey assembly services. Our vertically integrated business model enables us to provide our end customers with a complete manufactured solution”, stated Robert Nead, President at i3 Electronics.

 About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins Printed Circuit Board Fabrication Opportunity For Mobile Payments Industry

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has partnered with a leader in the “mobile payments” industry. For this project, i3 has developed a novel printed circuit board manufacturing process, which will greatly enable the customer’s ability to provide innovative mobile payment solutions.

“i3 is always looking to penetrate new markets, especially ones that show great growth potential. The proliferation of mobile payment technology has increased greatly over the past several years and we are pleased to be supplying our technology for these applications, stated Robert Nead, President at i3 Electronics.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Offering Printed Circuit Board Subcontracting Services

i3 Electronics, Inc. (i3) has decades of experience fabricating and assembling printed circuit boards (PCB) and semiconductor packages. i3 will now be offering PCB subcontracting services to the marketplace.

Our subcontracting services include:

  • Solderable Surface/ Wirebondable Finish Offerings
  • Universal Metal Surface Finish
  • Immersion Ag For Solderable Surface
  • High Temp/ Multiple Reflow Resistant OSP
  • Alternative Oxide Processing
  • Copper Plating
  • PTH Drilling/ Via Formation
  • Autoclave
  • Buried Resistor Trimming
  • And much more

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.