Why Every Major Tech Company Should Be Looking At i3 Electronics

We are living in a high-tech world. Everyday technology is advancing and evolving at a rate that has been unmatched in human history. Tech companies are looking for suppliers who can give them a distinct edge in the proverbial technology “space race”. We truly believe that our company has the technology and know-how to provide that “x-factor” for our customers. Our name might not be well known, but our technology is world-class.

 
“10 Interesting Facts You Didn’t Know About i3 Electronics”

  • i3 Electronics is one of the only 100% US-based suppliers that is vertically integrated in the electronics industry.
  • i3 Electronics currently has over 160 patents and trade secrets.
  • i3 Electronics’ Advanced Technology Research and Design group can assist you in the design of your next system including materials selection, system and board design, advanced packaging and lab material qualification testing
  • i3 Electronics’ Z-Interconnect technology has the ability to create the fastest printed circuit boards on the market. Enables speeds up to 40 Gbps.
  • i3 Electronics has the ability to manufacture advanced high performance dielectric materials at our North American Treater Tower facility.
  • i3 Electronics has fabricated and assembled significant hardware content for 4 out of the top 10 and 10 out of the top 50, fastest super computers in the world (see list on www.top500.org)
  • i3 Electronics’ MicroFlex technology has enabled companies that directly influenced the health and safety of millions of lives over the past 10 years.
  • i3 Electronics has placed over a half million die and over 1.4 Billion Flip Chip connects since 2002.
  • i3 Electronics’ system-in-package technology has been proven to reduce size, weight and power by over 20x for mission-critical applications.
  • i3 Electronics’ HyperBGA® technology can be found in almost every cell phone tower in the world.

To learn more about i3 Electronics, check out our website, www.i3electronics.com.

i3 Electronics, Inc. Wins System Integration Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has won an opportunity for final system integration work for a high performance, medical, super-computing application. i3 will be responsible for complete wiring, mechanical assembly, and assisting with debug.

“i3 Electronics has the expertise, people and equipment to be a very effective system integrator. Our vertically integrated business model allows us to be a complete solution to our customers. We are very excited to be working on this project,” said Robert Nead, President at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics Fabrication Highlight: March 2014

i3 will regularly highlight our capabilities in PCB/Substrate manufacturing by releasing information on a particular build.

The Application:

This substrate was designed and manufactured for the medical electronics market.

The Substrate

  • Laminate chip carrier
  • Polyimide material
  • 23 mils thick
  • 8 signal layers, 0 power layers
  • 2 x 1.5 in
  • Combination of blind and buried vias
  • Wirebondable gold surface finish

46E0946_11479589 8 layer-2

Why i3?

The customer came to i3 for this build because of our ability to produce a high reliability, polyimide substrate. i3 has a strong reputation for highly quality substrates for mission-critical applications.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Holds Business Development Summit

ENDICOTT, NY— i3 Electronics, Inc. (i3) held a two day business development summit from March 19th through March 20th. The summit brought together key employees from upper management, business development, marketing, supply chain, operations, finance, contracts and engineering to discuss ways to improve customer satisfaction, align company focus to meet customer needs, and increase visibility in the marketplace.

“i3 is dedicated to continually analyzing our business model and looking for ways that we can better support our customer base. Pulling together employees from a variety of different departments allows us to really get on the same page as an organization. We will continue to hold these summits on a quarterly basis,” said Neal Driver, Director of Programs & Business Development at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Wins New Printed Circuit Board QTA Opportunity

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that it has won a new Printed Circuit Board (PCB), Quick Turnaround (QTA) opportunity from a multinational semiconductor and communications company. i3’s PCB QTA operation will manufacture the PCBs, which contain micro vias and multiple subs, in only 15 days.

“i3’s QTA operation provides a distinct advantage to our customers and allows them a rapid time to market for their products. i3 is fabricating some very advanced PCBs at expedited cycle times,” said Jim Thornton, VP of Fabrications at i3.

To learn more about i3’s QTA click here.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics Fabrication Highlight: February 2014

i3 will regularly highlight our capabilities in PCB manufacturing by releasing information on a particular build.

The Application:

This printed circuit board was designed and manufactured for the high performance computing (HPC) market.

The PCB

  • Mixed Megtron 6 material
  • 200 mils thick
  • 36 layers
  • 22.6 x 17 in
  • 40,000 holes

PCB Highlight

Why i3?

The customer came to i3 for this build because of our ability to fabricate high layer count, complex PCB’s. i3 has a strong reputation for highly reliable and complex printed circuit board fabrication.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics To Exhibit & Present At IMAPS 10th International Conference & Exhibition On Device Packaging

i3 Electronics will be exhibiting at IMAPS 10th International Conference and Exhibition on Device Packaging being held March 10-13, 2014 at the Radisson Fort McDowell Resort and Casino, Scottsdale, AZ.

i3 will be located in booth #27.

i3′s Kim Blackwell, Director of Engineering, will be presenting the following paper at the show:

  • “Advanced Organic Substrate Technologies For High Performance, High Reliability Electronic Miniaturization” on 3/11 at 11:00 AM

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Advanced Laboratories Awarded Multiple Customer Contracts

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that its Advanced Laboratory Services business unit has received several high value contracts to perform failure analysis, reliability engineering services, SEM and other analytical work. The contracts are from significant US and international companies in various segments of the electronic packaging industry and run through the first half of 2014.

“Many of our customers are unaware of our Advanced Labs group and the vast services that they provide. Our labs specialize in material and failure analysis as well as reliability engineering, particularly CITC and CAF testing. Our lab services team is a true asset to our customer base and our company,” said Robert Nead President at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc. Awarded $7 Million Contract For HyperBGA Assemblies

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that an industry leading Computing & Hardware firm has awarded the Company a $7 million contract for the supply of  i3’s HyperBGA assemblies. The contract will run through Q4 of 2014.

“i3’s HyperBGA technology is a key enabler for many of our customers due to its unique ability for Size, Weight & Power (SWaP) reductions. Coupled with our assembly capabilities, i3 is well positioned to provide our customers with a complete electronic solution that is produced domestically,” said Robert Nead, President at i3.

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration and advanced laboratory services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.

i3 Electronics, Inc Awarded Contract For Printed Circuit Board Rework & Repair Services

ENDICOTT, NY— i3 Electronics, Inc. (i3) announced today that a multinational electronics manufacturer has awarded the Company contracts for the rework and repair of the customer’s advanced, high technology printed circuit board assemblies. i3’s work has enabled the customer to extend the life of their current product, resulting in immense cost savings for the customer.

 

“i3 is a very versatile company. Our vertically integrated structure allows us to do it all; from high performance computing systems and advanced semiconductor packaging, all the way down to rework and repair services. We are truly a complete solution to our customers,” said Robert Nead, President at i3 Electronics.

 

About i3 Electronics

i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic packaging solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board and integrated circuits assembly and test, systems integration, advanced laboratory services and printed circuit board subcontracting services.  i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success. For more information about i3 and its products, please visit www.i3electronics.com.