Leading the market, anticipating your needs
At Endicott Interconnect, we are innovators and scientists. With 10 years in the defense industry, we can anticipate market trends -- then innovate to match: we have invented, tested, and patented what you need before you even know you need it.
From prototype to volume assembly, Endicott Interconnect will meet and exceed your exacting requirements for mission-critical equipment in the following areas:
- Avionics and Controls
- Space and Airborne Applications
- Electronic Warfare
- Sensor Systems
- Network Centric Systems
- Unmanned Systems
- Intelligence and Surveillance Systems
- RF Applications
- Homeland Security
- Anti-Counterfeiting & Anti-Tamper Technologies
Our organic flip chip package specifically meets the needs of high performance applications where speed, reliability, and increased signal I/O are critical. These very dense, light and thin packages offer significant advantages over ceramics and are available as single chip or system-in-package (SiP) solutions.
We design, test, and manufacture at our own campus, providing rapid turnaround in a completely secure environment. And, as a domestic supplier, we are a highly dependable source, attaining Category 1A Trusted Integrated Circuit Supplier for Packaging status from the Department of Defense.
Click here to download a brochure with more information about our aerospace & defense capabilities.
To learn more about our military and defense technologies, call us today at (866) 820-4820.
