Innovative materials, superior performance

Our printed circuit board and semiconductor substrate materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS compliant and UL approved. Many provide high thermal reliability and CAF resistance for lead-free assembly compatibility.

Our featured electronic materials include:

Liquid Crystal Polymer
Offering high density interconnection with proven reliability and performance. This laminate can be packaged with six or more layers. Radiation tolerant, and with a low dielectric constant and dissipation factor.

EI Polyimide Laminate
Designed for lead free processing and high performance applications. Featuring a high Tg, low CTE and excellent moisture resistance.

Driclad® Laminate
High density digital, standard loss epoxy material with a proven track record. This time tested material features outstanding thermal and electrical properties and excellent reliability.

EI Black BT Laminate
Low cost alternative providing improved electrical performance and excellent CAF resistance.

Pramid Epoxy Laminate
Reinforced with non-woven, para aramid fibers, and offering low moisture absorption. An excellent Thermount® replacement.

Driclad® Silica Build Up
Highly filled resin coated copper used to form redistribution layers in printed circuit boards or construct semiconductor packages.

Driclad® Copper Paste Hole Fill
High copper content reduces CTE mismatch and enhances thermal conductivity. Fills high-aspect ratio holes.

Silica Epoxy Hole Fill
This hole fill is applied with a lamination process to provide void free filling of high-aspect holes.