- Aerospace & Defense
- High Performance Computing
- Solutions & Services
Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS compliant and UL approved. Many provide high thermal reliability and CAF resistance for lead-free assembly compatibility.
Our featured electronic materials include:
Circuitized Liquid Crystal Polymer
Offering high density interconnection with proven reliability and performance. This circuitized laminate can be packaged with six or more layers. Radiation tolerant, and with a low dielectric constant and dissipation factor.
Designed for lead free processing and high performance applications. Featuring a high Tg, low CTE and excellent moisture resistance.
High density digital, standard loss epoxy material with a proven track record. This time tested material features outstanding thermal and electrical properties and excellent reliability.
Black BT Laminate
Low cost alternative providing improved electrical performance and excellent CAF resistance.
Driclad® Silica Build Up
Highly filled resin coated copper used to form redistribution layers in printed circuit boards or semiconductor packaging fabrication.
Driclad® Copper Paste Hole Fill
High copper content reduces CTE mismatch and enhances thermal conductivity. Fills high-aspect ratio holes.
Silica Epoxy Hole Fill
This hole fill is applied with a lamination process to provide void free filling of high-aspect holes.