From prototype to volume production

At Endicott Interconnect we integrate advanced process and product development with manufacturing to provide flip chip and wire bond packaging assemblies ― from prototype to volume production.

We’ve earned global respect as assembly process experts, enabling customers to increase yields, continually improve processes, and optimize product reliability using our material science and engineering expertise.

Our solutions support the needs of the defense and aerospace, IT, server and super computing and medical markets where highly reliable products built in robust manufacturing operations are essential to success.

Click here to download our Semiconductor assembly datasheet.