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At Endicott Interconnect we have designed innovative organic semiconductor packaging that can be found in many of the world’s best-known electronic brands. We offer proven, validated solutions that can help you reduce risk, speed time to market, and reduce cycle times.
Semiconductor chips need to be connected to yet protected from the outside world. Increases in semiconductor circuit density pose challenges to the thermal, mechanical, and electrical integrity of the packaged device.
EI’s semiconductor packaging fabrication technology is designed to support new and advancing technologies so that gains made at the wafer level are not lost or compromised at the system level.
To learn more, call us today at (866) 820-4820.