Discover the Latest Technology with EI
Looking ahead to solve future needs
As part of EI’s world-renowned research and development team, our mission is simple: to create the best solutions for our clients in the electronic device industry.
We use our experience, knowledge, and expert techniques to generate cross- market solutions for defense, medical electronic devices, high-end computing, and specialty electronic products.
Our partnerships with academia, government, international companies, and local firms generate and promote technical advancements. These collaborative achievements include leading-edge materials science, process and manufacturing improvement, in-house testing and analysis capability, and new business opportunities.
At Endicott Interconnect, we focus our expertise on the following elements:
- System architecture
- Electrical design and packaging
- Power delivery systems
- Signal and power integrity analysis
- Thermal management
- Design verification and test
- Nano materials for high-performance packaging
- Electrical, thermal, and mechanical electronic packaging
- Advanced interconnects for optical and high-speed applications
R&D goals for the next five years
- Develop freestanding materials for the next generation of organic packaging
- Show feasibility of 4mm LW/ 6-8 mm LT using state of the art circuitization tools
- Implement opto-interconnect to transfer more information per channel
- Proliferate 3D interconnect in the electronic packaging industry
- Create “packaging fab” with R2R processing for PWBs and SCP
- Develop materials/packaging/processing/assembly and test for silicon packaging
LEARN MORE ABOUT OUR SOLUTIONS ยป
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Printed Circuit Board Fabrication
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Printed Circuit Board Assembly & Test
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Semiconductor Packaging Fabrication
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Semiconductor Assembly & Test
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System Integration & Test
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Materials
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System-in-Package
2012 Endicott Interconnect Technologies, Inc.©, Building 258, 1093 Clark Street, Endicott, NY 13760
(P) 866 820-4820 (F) 607 755-7000