Endicott Interconnect

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  • Government HPC
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  • Printed Circuit Board Fabrication
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  • Semiconductor Package Substrate Fabrication
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  • Advanced Electronic Packaging
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the test of excellence

At Endicott Interconnect, we offer a powerful combination of people, equipment, and expertise to add insight and value to product life designs, microelectronic technology testing, and materials science. We are partners with world class microelectronics industry leaders and we are a center of competence for reliability engineering testing and failure analysis. As a lab provider who is responsive to your needs, we provide:

• technology and product reliability qualifications
• product qualifications to customer specifications
• materials and failure analysis
• mechanical and fragility testing
• reliability engineering
• thermal and mechanical modeling

Our personal service from a team of experts with years of experience in microelectronics guarantees a test methodology that meets your needs. What sets us apart from other labs is that we provide solutions, not just data.

What sets EI apart from other labs?

• Experience-Average 20+ years experience with microelectronics reliability and materials analysis
• Expertise-Mechanisms and failure modes, material behaviors and interactions in microelectronics packaging
• Unique Approach-Collaborate with the customer to get a deeper understanding of the issue; working from problems to techniques
• Needle in Haystack-Tracing and identifying sub-micron level defects, locations and likely causes
• Solutions-Not just data but interpretation of results and the impacts to your product or process
• Patents-Infringement experience
• Flexibility-Quick turn analysis available
• Confidentiality-NDA capability, independent of operations
• Competitive Pricing

Have you heard about Endicott Interconnect's Current Induced Thermal Cycling (CITC) Tester?

For more information on our Advanced Lab Services contact us today at: 866 820-4820

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