- Aerospace & Defense
- High Performance Computing
- Solutions & Services
Endicott Interconnect Technologies, Inc. is a world leader in high-performance electronics packaging solutions. Our technology can be found in the world's fastest supercomputers, life-saving medical devices, complex imaging systems, mission-critical defense applications and thousands of other products, throughout the world.
We design, manufacture, test, and deliver printed circuit board fabrication, semiconductor packaging fabrication, and complex assembly solutions. Our customers include IBM, Cadence, Cisco, Boeing, Northrop Grumman, Raytheon, St. Jude Medical, GE Medical, Harris, DE Shaw, and the U.S. Department of Defense.
From our beginnings in 2002 as the successor to IBM’s microelectronics division in Endicott, N.Y. (formed in 1966), we have built a 1,400-strong team of scientists, engineers, and innovators that spreads across three continents.
Our goal as a company is to remain at the forefront of continued technological advancement. Our scientists and engineers collaborate with universities, research institutes, and customers to create industry-defining solutions, to innovate and challenge the technological landscape, and to generate fundamental change in our everyday lives.
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