Endicott Interconnect has built its foundation on providing engineered solutions for mission critical and high performance applications such as those found in, Defense and Aerospace, Medical and Advanced Test Equipment, Semiconductor, Server and Telecommunications systems. We focus on the unique needs of your product to deliver optimum performance in your application.
A Quality Leader
A systematic approach to quality management ensures a closed loop process from development through product end of life. Customer expectations and product attributes are combined with robust business processes and disciplined manufacturing utilizing process controls and monitors to deliver best in class reliability and defect rates.
EI products meet ISO, IPC and military specifications, RoHS compliance, ITAR registration and are compatible with lead free assembly processes.
View our quality policy >
A Highly Reliable Product Set
The ability to withstand demanding environments is critical in defense/aerospace applications and long term performance is of particular concern. At EI, we conduct extensive reliability testing to understand the long term performance characteristics and the interaction of the materials, processes and design considerations of our products. We use a battery of tests to evaluate numerous factors including the chemical compatibility of the materials used in processing; the mechanical integrity of devices due to thermal expansion differences of the various materials used in assembly; and the effects of temperature, humidity, shock and vibration and
ionic contamination on components and assemblies.
Products that Perform
Designers are challenged to minimize weight and pack as much functionality as possible into exceedingly tight spaces, without sacrificing performance or reliability. EI’s organic substrate product offerings achieve exceptional electrical and thermal performance, while attaining a small footprint, thin profile and high reliability.
Electrical Performance
Low coupled noise and very low power distribution inductance means our packages have faster signal speeds and higher signal integrity. This allows you to process, analyze and monitor more information, faster with clearer signals and connections.
Eye Diagram from 20mm
line on CoreEZTM, 15.5Gbps data
Thermal Performance
Semiconductor packages and PCBs can be design optimized to maximize heat transfer and improve temperature withstanding capabilities. Precise thermal models can be developed at the package or system level to analyze convection, conduction or radiation cooling. Our in-house tool and die shop allows us to design and fabricate prototype hardware. Complete electronics and test vehicles are assembled and placed in testing for thermal performance.
Conduction cooling of semiconductor package attached to PCB
Manufacturing Know-How
Our engineering and manufacturing capabilities are
vertically integrated for maximum efficiency, resulting in superior speed, flexibility and cost effectiveness. With our tightly integrated system, you will save time and money as you eliminate the need for numerous suppliers and delays caused by shipping between facilities. EI offers outstanding service and on-time delivery performance and specializes in prototype to medium volume production quantities. We offer a strong component traceability system and integrate flexible supply chain management into our execution model to better meet your cost goals.
EI products and services that are ideally suited to our target
markets:
Semiconductor Packaging
Organic substrates designed to provide superior electrical performance along with high reliability. These are very dense, light and thin packages and are available as single chip or system-in-package solutions.
Printed Circuit Boards
A total solution for PCB fabrication including physical design and modeling, technology
development, applications and quality engineering, field reliability simulation
and analysis and life cycle support.
Precision Equipment Manufacturing Development and manufacture of custom equipment in secure and highly regulated environments as well as those with stringent quality system requirements and intellectual property concerns.
Complex Assembly Solutions
Expert production of a wide range of products from low complexity to high end, very complex and mission critical items.
Technical Services
Design, modeling, simulation and testing services, including physical, mechanical, chemical, environmental and more.
Semiconductor Packaging
Organic substrates designed to provide superior electrical performance along with high reliability. These are very dense, light and thin packages and are available as single chip or system-in-package solutions.
Printed Circuit Boards
A total solution for PCB fabrication including physical design and modeling, technology
development, applications and quality engineering, field reliability simulation
and analysis and life cycle support.
Precision Equipment Manufacturing Development and manufacture of custom equipment in secure and highly regulated environments as well as those with stringent quality system requirements and intellectual property concerns.
Complex Assembly Solutions
Expert production of a wide range of products from low complexity to high end, very complex and mission critical items.
Technical Services
Design, modeling, simulation and testing services, including physical, mechanical, chemical, environmental and more.